Power chips are attached to exterior circuits through product packaging, and their efficiency relies on the support of the packaging. In high-power circumstances, power chips are generally packaged as power components. Chip affiliation refers to the electric link on the top surface area of the chip, which is generally light weight aluminum bonding wire in typical modules. ^
Conventional power component plan cross-section
Currently, commercial silicon carbide power components still mainly use the product packaging innovation of this wire-bonded typical silicon IGBT component. They face issues such as big high-frequency parasitical specifications, inadequate warm dissipation capacity, low-temperature resistance, and inadequate insulation toughness, which limit the use of silicon carbide semiconductors. The display of superb efficiency. In order to address these issues and totally exploit the huge potential benefits of silicon carbide chips, many new packaging innovations and options for silicon carbide power modules have actually arised in recent years.
Silicon carbide power module bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have actually created from gold cord bonding in 2001 to aluminum cable (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have actually developed from gold cables to copper cords, and the driving force is expense reduction; high-power tools have established from aluminum wires (strips) to Cu Clips, and the driving force is to boost item efficiency. The greater the power, the greater the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that utilizes a strong copper bridge soldered to solder to connect chips and pins. Compared to traditional bonding packaging techniques, Cu Clip innovation has the complying with benefits:
1. The connection between the chip and the pins is made from copper sheets, which, to a particular level, changes the standard wire bonding technique in between the chip and the pins. Therefore, an unique plan resistance worth, higher existing flow, and far better thermal conductivity can be obtained.
2. The lead pin welding location does not require to be silver-plated, which can totally conserve the cost of silver plating and bad silver plating.
3. The product appearance is entirely consistent with typical items and is generally used in servers, portable computer systems, batteries/drives, graphics cards, motors, power products, and other fields.
Cu Clip has two bonding methods.
All copper sheet bonding technique
Both eviction pad and the Source pad are clip-based. This bonding approach is much more pricey and intricate, but it can attain far better Rdson and better thermal effects.
( copper strip)
Copper sheet plus wire bonding approach
The source pad utilizes a Clip technique, and eviction uses a Cord technique. This bonding technique is somewhat less costly than the all-copper bonding approach, conserving wafer location (suitable to extremely small gate areas). The procedure is easier than the all-copper bonding technique and can acquire much better Rdson and better thermal effect.
Distributor of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding southern copper, please feel free to contact us and send an inquiry.
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